The Expanded TSMC Open Innovation Platform Drives New Ecosystem Collaboration to Enable Next-Generation HPC and Mobile Applications
TSMC (TSE: 2330, NYSE: TSM) today announced the Open Innovation Platform® (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric™ Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness, with a full spectrum of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging. This alliance will help customers achieve speedy implementation of silicon and system-level innovations and enable next-generation HPC and mobile applications using TSMC’s 3DFabric technologies, a comprehensive family of 3D silicon…
