Transparency Market Research (TMR) estimates that the global thin wafer processing and dicing equipment market has a highly consolidative landscape. Disco Corp. accounted for largest share of 56.4% in 2015 and likely to be dominant in the coming years. This is creating monopoly in the thin wafer processing and dicing equipment market in terms of competitive presence. The other key players such as EV Group, Plasma-Therm LLC, Lam Research Corp, Advanced Dicing Technologies, and Tokyo Electron Ltd. are operating in the global thin wafer processing and dicing equipment market.
According to TMR, the global thin wafer processing and dicing equipment market is likely to expand at a CAGR of 6.80% over the forecast period to attain a value of US$692.5 mn by 2024-end. The market had acquired a value of US$388.9 mn in 2015.
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