(MENAFN- PR Newswire) NEW YORK, April 10, 2024 /PRNewswire/ — The global semiconductor advanced packaging market
size is estimated to grow by USD 22.79 billion
from 2024 to 2028, according to Technavio. The market is estimated to grow at a CAGR of over 8.72% during the forecast period.
The automotive industry’s shift towards electrification and automation drives the semiconductor market, with ICs used for airbags, GPS, braking systems, displays, infotainment, power doors, windows, and automated driving. Small size and right form factor necessitate advanced packaging solutions. Keywords: Miniaturization, Chip packaging, Integrated circuits, WLP, RFID, MEMS, Power devices, AI, ML, DL, Industrial sector, Fan-Out WLP, PLC, Embedded processors, High performance, Low power consumption.
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Technavio has announced its latest market…
