Qualcomm and TDK kick off $3B radio chip venture

has officially launched its joint venture with Japan’s TDK aimed at expanding the San Diego company’s chip content in smartphones, cars and Internet of Things devices. The new company is called RF360 Holdings and will produce filters, power amplifiers, envelope trackers and other chips used to….

Posted: 2017-02-08 01:23:00

Read all

Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.