The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what works best for different processes and technologies.
At its core, advanced packaging depends on reliable interconnects, well-defined signal paths, and minimization of nuisance effects like insertion losses, interconnect crosstalk, substrate warpage, and hot spots in the system. Those can vary significantly depending on the choice of package, which can be anything from 2.5D, fan-out chip-on-substrate (FOCoS), 3D-ICs, or bridges that may be used separately or in conjunction with the other approaches.
And that’s just for starters. Semiconductor packaging roadmaps emphasize robust interfaces at every turn, but which…
