5G

Fibocom : to Be The First in Providing Engineering Samples of 5G Module Based on MediaTek Chipset Platform

Chief Editor January 13, 2021 0 12 sec read
(marketscreener.com) Fibocom , a leading global provider of IoT wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is based on the MediaTek chipset platform and will be available in two versions.

Posted: 2021-01-13 16:06:00

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